The way to peace (Record no. 80341)
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000 -LEADER | |
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fixed length control field | 00496nam a22001691a 4500 |
003 - CONTROL NUMBER IDENTIFIER | |
control field | USJPLib |
008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION | |
fixed length control field | 140924b xxu||||| |||| 00| 0 eng d |
041 ## - LANGUAGE CODE | |
Language code of text/sound track or separate title | English |
082 ## - DEWEY DECIMAL CLASSIFICATION NUMBER | |
Classification number | 294.3 |
Item number | KOM |
100 ## - PERSONAL NAME (AUTHOR) | |
Personal name | Komatsu, Chiko |
9 (RLIN) | 17926 |
700 ## - ADDED ENTRY--PERSONAL NAME | |
Personal name | Sekimari, Gaynor Jenke |
Relator term | Translator |
9 (RLIN) | 17927 |
245 ## - TITLE STATEMENT | |
Title | The way to peace |
Remainder of title | the life and teaching of the Buddha |
Medium | [Text] |
Statement of responsibility, etc | Komatsu, Chiko |
260 ## - PUBLICATION, DISTRIBUTION, ETC. (IMPRINT) | |
Name of publisher, distributor, etc | Hozokan |
Place of publication, distribution, etc | Kyoto |
Date of publication, distribution, etc | 1989 |
300 ## - PHYSICAL DESCRIPTION | |
Extent | xxvi, 641 p. |
Other physical details | plates, |
Dimensions | 22 cm. |
650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM | |
Topical term or geographic name as entry element | Buddhism |
9 (RLIN) | 65 |
942 ## - ADDED ENTRY ELEMENTS (KOHA) | |
Source of classification or shelving scheme | Dewey Decimal Classification |
Koha item type | Lending Materials |
Withdrawn status | Lost status | Source of classification or shelving scheme | Damaged status | Not for loan | Collection code | Home library | Current library | Shelving location | Date acquired | Cost, normal purchase price | Total Checkouts | Total Renewals | Full call number | Barcode | Date last seen | Date checked out | Copy number | Price effective from | Koha item type |
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Dewey Decimal Classification | Lending Collection | Main Library | Main Library | Lending Division | 23/11/2013 | 0.00 | 1 | 1 | 294.3 KOM | 117543 | 17/01/2017 | 22/12/2016 | 1 | 23/11/2013 | Lending Materials |