Microprocessors (Record no. 48725)
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| 000 -LEADER | |
|---|---|
| fixed length control field | 00444nam a22001691a 4500 |
| 003 - CONTROL NUMBER IDENTIFIER | |
| control field | USJPLib |
| 008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION | |
| fixed length control field | 140924b xxu||||| |||| 00| 0 eng d |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER | |
| International Standard Book Number | 9780895880420 |
| 082 ## - DEWEY DECIMAL CLASSIFICATION NUMBER | |
| Classification number | 621.38195 |
| Item number | ZAK |
| 100 ## - PERSONAL NAME (AUTHOR) | |
| Personal name | Zaks, Rodnay |
| 245 ## - TITLE STATEMENT | |
| Title | Microprocessors |
| Remainder of title | from chips to systems |
| Medium | [Text] |
| Statement of responsibility, etc | Zaks, Rodnay |
| 250 ## - EDITION STATEMENT | |
| Edition statement | 3rd ed. |
| 260 ## - PUBLICATION, DISTRIBUTION, ETC. (IMPRINT) | |
| Name of publisher, distributor, etc | SYBEX |
| Place of publication, distribution, etc | New York |
| Date of publication, distribution, etc | 1980 |
| 300 ## - PHYSICAL DESCRIPTION | |
| Extent | 413 p. |
| Dimensions | 22 cm. |
| 650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical term or geographic name as entry element | Applied Physics |
| 942 ## - ADDED ENTRY ELEMENTS (KOHA) | |
| Source of classification or shelving scheme | Dewey Decimal Classification |
| Koha item type | Lending Materials |
| Withdrawn status | Lost status | Source of classification or shelving scheme | Damaged status | Not for loan | Collection code | Home library | Current library | Shelving location | Date acquired | Cost, normal purchase price | Total Checkouts | Full call number | Barcode | Date last seen | Date checked out | Copy number | Price effective from | Koha item type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Dewey Decimal Classification | Lending Collection | Main Library | Main Library | Lending Division | 23/11/2013 | 0.00 | 1 | 621.38195 ZAK | 087344 | 26/05/2016 | 12/05/2016 | 1 | 23/11/2013 | Lending Materials |